PJ-038-SMT-TR DC power JACK 0.65 mm center pin 1.0 A rating
SOLDERABILITY
| parameter | conditions/description | min | typ | max | units |
| reel storage | 10~30°C, <70% humidity | ℃ | |||
| reflow soldering1 | see reflow profile | 255 | 260 | ℃ | |
| drying conditions2 | parts in reel: bake at 110°C for 4 hours parts removed from reel: bake at 110°C for 4 hours |
NOTE:
1. CUI Devices recommends to solder within 72 hours from opening vacuum packaging at a temperature <30°C & relative humidity <60%.
2. When exceeding floor life by >240 hours.
PRODUCT DRAWING
PACKAGEING
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