SJ-3502-SMT-TR MID MOUNT AUDIO JACK Mid mount for low profile applications
SOLDERABILITY
Parameter | Conditions/Description | min | typ | max | units |
Reel storage | at relative humidity<80% | 40 | ℃ | ||
Reflow soldering1 | See reflow profile | 255 | 260 | 265 | ℃ |
Drying conditions2 | Parts in real:bake at 40℃±5℃ for 72 hours
Parts removed from reel:bake at 40℃±5℃ for 10 hours |
Note:
1. It is recommended to reflow solder within 72 hours from opening vacuum packaging at a temperature <30°C & relative humidity <60%.
2. When exceeding floor life by >72 hours.
PRODUCT DRAWING
PACKAGE DRAWING
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